E-mail this Article
Review
반도체 배선을 위한 구리 증착 기술의 개발 현황
Seung-Gon Park, Do-Hyeong Kim
DOI :
https://doi.org/
Your Name *
Your E-mail *
Recipient's E-mail *
Message
/
500
characters
Home
E-submission
Sitemap
Contact us
HOME
ABOUT
Aims and scope
About the journal
Editorial board
Open access
Contact us
BROWSE ARTICLES
All issues
Current issue
Ahead-of print
Most view
Most download
Most cited
Funded articles
Search
Author index
EDITORIAL POLICY
Research and publication ethics
AUTHOR INFORMATION
Instructions for authors
Author’s checklist
E-submission
Copyright transfer agreement
Search
Ceramist Search
CLOSE
Review
Ceramist 2001;4(1):67-74.
Published online February 28, 2001.
Seung-Gon Park
,
Do-Hyeong Kim
반도체 배선을 위한 구리 증착 기술의 개발 현황
박승곤, 김도형
전남대학교 공과대학 응용화학부
TOOLS
PDF Links
Full text via DOI
Download Citation
E-Mail
Share :
METRICS
740
View
2
Download
Related articles in
Ceramist
ABOUT
Aims and scope
About the journal
Editorial board
Open access
Contact us
BROWSE ARTICLES
All issues
Current issue
Ahead-of print
Most view
Most download
Most cited
Funded articles
Search
Author index
EDITORIAL POLICY
Research and publication ethics
AUTHOR INFORMATION
Instructions for authors
Author’s checklist
E-submission
Copyright transfer agreement