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Volume 8(6); Dec 2005
Review
차세대 SoP-L 공정기술 동향
박세훈, 강남기, 박종철, 차종범
Ceramist. 2005;8(6):7-14.   Published online December 31, 2005
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차세대 시스템패키지를 위한 세라믹 기술 (SoP-C) 개발
김효태, 남중희, 여동훈, 신효순, 왕종회, 김종희
Ceramist. 2005;8(6):15-22.   Published online December 31, 2005
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반도체 패키지용 이방성 전도성 접착제 기술의 최신 동향
백경욱, 임명진
Ceramist. 2005;8(6):23-39.   Published online December 31, 2005
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RF 패키징 기술
선용빈
Ceramist. 2005;8(6):40-45.   Published online December 31, 2005
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SOP (System-on-Packaging) for Mega-Function System Integration
윤종광
Ceramist. 2005;8(6):46-52.   Published online December 31, 2005
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