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Review
- 차세대 SoP-L 공정기술 동향
- 박세훈, 강남기, 박종철, 차종범
- Ceramist. 2005;8(6):7-14. Published online December 31, 2005
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- 차세대 시스템패키지를 위한 세라믹 기술 (SoP-C) 개발
- 김효태, 남중희, 여동훈, 신효순, 왕종회, 김종희
- Ceramist. 2005;8(6):15-22. Published online December 31, 2005
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- 반도체 패키지용 이방성 전도성 접착제 기술의 최신 동향
- 백경욱, 임명진
- Ceramist. 2005;8(6):23-39. Published online December 31, 2005
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- SOP (System-on-Packaging) for Mega-Function System Integration
- 윤종광
- Ceramist. 2005;8(6):46-52. Published online December 31, 2005
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